Beelink SER9 Pro HX 370 32GB
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Key Specifications
Manufacturer: Beelink
Processor: HX 370
Generation: Zen 5
Cores/Threads: 12/24
Integrated GPU: RDNA3.5 890M
Max RAM: 32GB
Release Date: October 2024
TDP: 54W
Processor & Graphics
CPU Details
Manufacturer: AMD
Generation: Zen 5
Tier: Ryzen 9
Model: HX 370
Cores: 12
Threads: 24
Graphics
Integrated GPU: Yes
iGPU Model: RDNA3.5 890M
Dedicated GPU: Not specified
Max Displays: 3
Memory & Storage
Memory (RAM)
RAM Options: 32GB
Maximum RAM: 32GB
RAM Slots: 0
RAM Generation: DDR5
RAM Type: Soldered
RAM Speed: 8000MHz
ECC Support: No
Storage
Drive Options: 1TB
Max Drives: 0
NVMe Configuration: 2x Gen 4x4
NVMe Drives: 2
M.2 2242 Slots: 0
M.2 2280 Slots: 2
2.5" Drives: 0
3.5" Drives: 0
mSATA Slots: 0
mSATA2 Slots: 0
SD Card Slots: 0
Connectivity & Ports
USB Ports
USB-A 2.0: 1
USB-A 3.0: 3
USB-C 3.0: 0
USB-C 4.0: 1
USB-PD Ports: 1
USB-PD Wattage: 100W
USB-C Features: USB4 • 100W PD
Display & Network
HDMI Ports: 1
HDMI Configuration: HDMI 2.1
DisplayPort: 1
DP Configuration: 1x DP 2.0
OCuLink: No
Ethernet Ports: 1
Ethernet Configuration: 1x 2.5GbE
Ethernet Controller: Realtek RTL8125
WiFi: WiFi 6
WiFi Controller: MediaTek MT7922
Bluetooth: Bluetooth 5.2
3.5mm Ports: 1
PCIe Configuration: Gen 4
0 Power & Physical Specifications
Power
TDP: 54W
PSU Wattage: 100W
PSU Type: GaN
Power Connector: [object Object]
Battery: Not specified
Physical
Dimensions (W×D×H): 135 × 135 × 44 mm
Volume: 0.8019L
Weight: 750g
Kensington Lock: No
Noise Level: Not specified
Cooling System
| Type | Active |
| Method | Air |
| Fan Count | 1 |
System & Software
System Information
Release Date: October 2024
Handheld: No
Built-in Screen: No
BIOS: AMI
Warranty: 1.5 years
Operating System: None • Windows 11 Pro